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This is a documentation subpage for Template:Semiconductor manufacturing processes. It may contain usage information, categories and other content that is not part of the original template page. This template is intended primarily for the Semiconductor articles.
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
This template is not intended as a location for content. It is a navigational aide that lets a reader go to the article that describes the listed process. The template is intended to be right-aligned and vertically oriented in articles that include it, so we want it to be narrow.
A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...
Roughly saying, digital IC design can be divided into three parts. Electronic system-level design: This step creates the user functional specification. The user may use a variety of languages and tools to create this description. Examples include a C/C++ model, VHDL, SystemC, SystemVerilog Transaction Level Models, Simulink, and MATLAB.
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Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.