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Cheap sandpaper was often passed off as glass paper; Stalker and Parker cautioned against it in A Treatise of Japaning and Varnishing published in 1688. [5] In 1921, 3M invented a sandpaper with silicon carbide grit and a waterproof adhesive and backing, known as Wet and dry. This allowed use with water, which would serve as a lubricant to ...
the chemical composition of the abrasive particles (common abrasives include diamond, cubic boron nitride (CBN), chromium(III) oxide, tungsten carbide, silicon carbide and other ceramics). In synthetic stones, the grit size is related to the mesh size used to select the particles to be included in the abrasive. Sandpaper also uses a similar system.
Bulk micromachining starts with a silicon wafer or other substrates which is selectively etched, using photolithography to transfer a pattern from a mask to the surface. Like surface micromachining, bulk micromachining can be performed with wet or dry etches, although the most common etch in silicon is the anisotropic wet etch.
Surface grinding is done on flat surfaces to produce a smooth finish.. It is a widely used abrasive machining process in which a spinning wheel covered in rough particles (grinding wheel) cuts chips of metallic or nonmetallic substance from a workpiece, making a face of it flat or smooth.
Silicon carbide (SiC), also known as carborundum (/ ˌ k ɑːr b ə ˈ r ʌ n d əm /), is a hard chemical compound containing silicon and carbon. A wide bandgap semiconductor , it occurs in nature as the extremely rare mineral moissanite , but has been mass-produced as a powder and crystal since 1893 for use as an abrasive .
This process is now largely outdated but was used up until the late 1980s when it was superseded by dry plasma etching. [1]: 147 The wafer can be immersed in a bath of etchant, which must be agitated to achieve good process control. For instance, buffered hydrofluoric acid (BHF) is used commonly to etch silicon dioxide over a silicon substrate.
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