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Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...
Solder (UK: / ˈ s ɒ l d ə, ˈ s ə ʊ l d ə /; [1] NA: / ˈ s ɒ d ər /) [2] is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling.
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
Brazing and soldering processes classification chart [7] There are three forms of soldering, each requiring progressively higher temperatures and producing an increasingly stronger joint strength: soft soldering, which originally used a tin-lead alloy as the filler metal; silver soldering, which uses an alloy containing silver
Yield strength (0.2% offset, ksi) Tensile strength (ksi) Elongation in 2 inches (percent) Hardness (Brinell scale) Comments Copper (ASTM B1, B2, B3, B152, B124, R133) Cu 99.9 Annealed 10 32 45 42 Electrical equipment, roofing, screens Cold-drawn 40 45 15 90 Cold-rolled 40 46 5 100 Gilding metal (ASTM B36) Cu 95.0, Zn 5.0 Cold-rolled 50 56 5 114
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.
A high-temperature solder. For medium-strength joints. Can join copper, brass and steel. Used where joint strength needs to be higher than achievable by solders and temperature must be low, e.g. thermostatic bellows operating at temperatures too high for soft solders and requiring being joined below their annealing temperature.