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The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
Two AMD Ryzen 9000 series microprocessors with Zen 5 architecture. Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4]
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
Llano AMD Fusion (K10 cores + Redwood-class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017) [ edit ]
Zen is a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), Ryzen Threadripper (workstation and high end desktop), and Epyc (server).
AMD Family 11h – combined elements of K8 and K10 designs for Turion X2 Ultra / Puma mobile platform. AMD Fusion Family 12h – based on the 10h/K10 design. Includes CPU cores, GPU and Northbridge in the same chip. Llano was the first design which implemented it. Fusion was later re-branded as the APU.
5957 19674 Ensembl ENSG00000109047 ENSMUSG00000020907 UniProt P35243 P34057 RefSeq (mRNA) NM_002903 NM_009038 RefSeq (protein) NP_002894 NP_033064 Location (UCSC) Chr 17: 9.9 – 9.91 Mb Chr 11: 67.59 – 67.59 Mb PubMed search Wikidata View/Edit Human View/Edit Mouse Recoverin is a 23 kilodalton (kDa) neuronal calcium-binding protein that is primarily detected in the photoreceptor cells of ...
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]