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  2. Integrated circuit design - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_design

    Engineer using an early IC-designing workstation to analyze a section of a circuit design cut on rubylith, circa 1979. Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs

  3. Integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit

    A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. [1]

  4. Integrated circuit layout - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_layout

    Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.

  5. Very-large-scale integration - Wikipedia

    en.wikipedia.org/wiki/Very-large-scale_integration

    Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (metal oxide semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunications technologies.

  6. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]

  7. Electronic design automation - Wikipedia

    en.wikipedia.org/wiki/Electronic_design_automation

    Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), [1] is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips.

  8. Mead–Conway VLSI chip design revolution - Wikipedia

    en.wikipedia.org/wiki/Mead–Conway_VLSI_chip...

    The Mead–Conway VLSI chip design revolution, or Mead and Conway revolution, was a very-large-scale integration design revolution starting in 1978 which resulted in a worldwide restructuring of academic materials in computer science and electrical engineering education, and was paramount for the development of industries based on the application of microelectronics.

  9. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    In integrated circuit (IC) design, a via is a small opening in an insulating oxide layer that allows a conductive connection between different layers. A via on an integrated circuit that passes completely through a silicon wafer or die is called a through-chip via or through-silicon via (TSV).