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The first DDR4 memory module prototype was manufactured by Samsung and announced in January 2011. [a] Physical comparison of DDR, DDR2, DDR3, and DDR4 SDRAM Front and back of 8 GB [1] DDR4 memory modules. 2005: Standards body JEDEC began working on a successor to DDR3 around 2005, [14] about 2 years before the launch of DDR3 in 2007.
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 banks for each bank group for ×16 DRAM. The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed
It is for this reason that DDR3-2666 CL9 has a smaller absolute CAS latency than DDR3-2000 CL7 memory. Both for DDR3 and DDR4, the four timings described earlier are not the only relevant timings and give a very short overview of the performance of memory. The full memory timings of a memory module are stored inside of a module's SPD chip.
A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins . [ 1 ] The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards , although there are proprietary DIMMs.
8 or 16 GB DDR4 RAM, 2666 MHz (2 slots, up to 32 GB) 128 GB / 256 GB / 512 GB M.2 PCIe NVMe SSD 1 TB 5400 rpm 2.5" SATA NVIDIA GeForce GTX 1050 with 4 GB of GDDR5 memory or GeForce GTX 1050 Ti with 4 GB of GDDR5 memory or GeForce GTX 1060 Max-Q with 6 GB of GDDR5 memory 15.6", 1920×1080 (16:9), 141 ppi, IPS Anti-Glare LED-Backlit
Memory: 4 GB DDR4 2666 MHz (minimum); 32 GB DDR4 2666 MHz (maximum) Hard drive : 256 GB M.2 PCIe NVMe Solid State Drive + 1 TB 7200 rpm 3.5-inch SATA hard drive Bluetooth : 4.0, 2.4 GHz, 1x1