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  2. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    A development in bond strength testing of adhesively bonded composite structures is laser bond inspection (LBI). LBI provides a relative strength quotient derived from the fluence level of the laser energy delivered onto the material for the strength test compared to the strength of bonds previously mechanically tested at the same laser fluence.

  3. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...

  4. Testing of advanced thermoplastic composite welds - Wikipedia

    en.wikipedia.org/wiki/Testing_of_Advanced...

    There are not codes made specifically for the welding of advanced thermoplastic composite welds, so the codes for adhesive bonding of plastics and metals [1] [3] are slightly altered, and used in order to properly test these materials. Even though the joining method is different these materials have mechanical requirements they need to meet.

  5. Polyoxymethylene - Wikipedia

    en.wikipedia.org/wiki/Polyoxymethylene

    [25] [26] In order to get a high bond strength without specialized tools, treatments, or roughening, one can use Loctite 401 prism adhesive combined with Loctite 770 prism primer to get bond strengths of ~1700psi. [24] Once the surface is prepared, a number of adhesives can be used for bonding. These include epoxies, polyurethanes, and ...

  6. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.

  7. Ceramic matrix composite - Wikipedia

    en.wikipedia.org/wiki/Ceramic_matrix_composite

    A strong bond would require a very high elongation capability of the fiber bridging the crack and would result in a brittle fracture, as with conventional ceramics. The production of CMC material with high crack resistance requires a step to weaken this bond between the fibers and matrix.