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  2. Pin grid array - Wikipedia

    en.wikipedia.org/wiki/Pin_grid_array

    Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...

  3. CPU socket - Wikipedia

    en.wikipedia.org/wiki/CPU_socket

    CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...

  4. Socket A - Wikipedia

    en.wikipedia.org/wiki/Socket_A

    Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors (derived from the Mobile Athlon XP).

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder. Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.

  6. Land grid array - Wikipedia

    en.wikipedia.org/wiki/Land_grid_array

    LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]

  7. Ball grid array - Wikipedia

    en.wikipedia.org/wiki/Ball_grid_array

    This is thinner than a pin grid array socket arrangement, but is not removable. The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable micro-FCPGA package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.