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Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
The polonium could then be deposited on copper or nickel sheets. This required large-scale glass-lined equipment not available in Dayton, but available at the Monsanto B plant in Monsanto, Illinois. After small-scale tests at Unit III revealed that the process was practical, some three tons of lead dioxide were sent to the B plant, and 2.50 ...
Armor plating for tanks in World War II. Correction fluid - Snopake, the first correction fluid, developed in 1955; Universal Product Code - Development of the Universal Product Code (UPC) in 1965; Cruise control - for automobiles in 1970; Photovoltaic cell - the first all-sputtered photovoltaic cell for solar energy in 1974.
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2-) (or a borohydride-like compound) as a reducer. [6] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [16] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
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