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  2. Packing problems - Wikipedia

    en.wikipedia.org/wiki/Packing_problems

    The hexagonal packing of circles on a 2-dimensional Euclidean plane. These problems are mathematically distinct from the ideas in the circle packing theorem.The related circle packing problem deals with packing circles, possibly of different sizes, on a surface, for instance the plane or a sphere.

  3. Bin packing problem - Wikipedia

    en.wikipedia.org/wiki/Bin_packing_problem

    Many techniques from bin packing are used in this problem too. [52] In the guillotine cutting problem, both the items and the "bins" are two-dimensional rectangles rather than one-dimensional numbers, and the items have to be cut from the bin using end-to-end cuts. In the selfish bin packing problem, each item is a player who wants to minimize ...

  4. RoboDK - Wikipedia

    en.wikipedia.org/wiki/RoboDK

    The simulation software allows you to program robots outside the production environment, eliminating production downtime caused by shop floor programming. [2] RoboDK includes tools that can be used for many robotics projects including milling, welding, pick and place, packaging and labelling, palletizing, painting, robot calibration and more. [3]

  5. Sphere packing in a sphere - Wikipedia

    en.wikipedia.org/wiki/Sphere_packing_in_a_sphere

    Sphere packing in a sphere is a three-dimensional packing problem with the objective of packing a given number of equal spheres inside a unit sphere. It is the three-dimensional equivalent of the circle packing in a circle problem in two dimensions.

  6. Sphere packing - Wikipedia

    en.wikipedia.org/wiki/Sphere_packing

    Sphere packing finds practical application in the stacking of cannonballs. In geometry, a sphere packing is an arrangement of non-overlapping spheres within a containing space. The spheres considered are usually all of identical size, and the space is usually three-dimensional Euclidean space.

  7. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    3D packaging refers to 3D integration schemes that rely on traditional interconnection methods such as wire bonding and flip chip to achieve vertical stacking. 3D packaging can be divided into 3D system in package (3D SiP) and 3D wafer level package (3D WLP). 3D SiPs that have been in mainstream manufacturing for some time and have a well ...

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  9. Next-fit bin packing - Wikipedia

    en.wikipedia.org/wiki/Next-fit_bin_packing

    Next-fit is an online algorithm for bin packing. Its input is a list of items of different sizes. Its output is a packing - a partition of the items into bins of fixed capacity, such that the sum of sizes of items in each bin is at most the capacity. Ideally, we would like to use as few bins as possible, but minimizing the number of bins is an ...

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