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Nitriding is a heat treating process that diffuses nitrogen into the surface of a metal to create a case-hardened surface. These processes are most commonly used on low-alloy steels. These processes are most commonly used on low-alloy steels.
Despite the naming, the process is a modified form of nitriding and not carburizing. The shared attribute of this class of this process is the introduction of nitrogen and carbon in the ferritic state of the material. The processes are divided into four main classes: gaseous, salt bath, ion or plasma, or fluidized-bed. The trade name and ...
For instance, carbon tetrachloride (CCl 4) etches silicon and aluminium, and trifluoromethane etches silicon dioxide and silicon nitride. A plasma containing oxygen is used to oxidize ("ash") photoresist and facilitate its removal. Ion milling, or sputter etching, uses lower pressures, often as low as 10 −4 Torr (10 mPa).
A reactive-ion etching setup in a laboratory cleanroom. Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers.
Iron has five nitrides observed at ambient conditions, Fe 2 N, Fe 3 N 4, Fe 4 N, Fe 7 N 3 and Fe 16 N 2.They are crystalline, metallic solids. Group 7 and group 8 transition metals form nitrides that decompose at relatively low temperatures—iron nitride, Fe 2 N decomposes with loss of molecular nitrogen at around 400 °C and formation of lower-nitrogen content iron nitrides.
Manganese nitrides are salts of manganese and the nitride ion. Four of these compounds are stable at atmospheric pressure.The most important is Mn 3 N 2, which catalyzes nitrogen fixation and is a high-temperature antiferromagnet.
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