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  2. Paint adhesion testing - Wikipedia

    en.wikipedia.org/wiki/Paint_adhesion_testing

    An X-cut is made through the film with a carbide tip tool to the substrate. Pressure-sensitive tape is applied over the cut. Tape is smoothed into place using a pencil eraser over the area of the incisions. Tape is removed by pulling it off rapidly back over itself as close to an angle of 180°. Adhesion is assessed on a 0 to 5 scale.

  3. Pull off test - Wikipedia

    en.wikipedia.org/wiki/Pull_off_test

    A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.

  4. Shore durometer - Wikipedia

    en.wikipedia.org/wiki/Shore_durometer

    The measurement must be redone with adjacent scale type. Pig sticker used to measure the hardness of pugged clay. Durometer is a dimensionless quantity, and there is no simple relationship between a material's durometer in one scale, and its durometer in any other scale, or by any other hardness test. [1]

  5. Dispersive adhesion - Wikipedia

    en.wikipedia.org/wiki/Dispersive_adhesion

    Surface roughness can also affect the adhesive strength. Surfaces with roughness on the scale of 1–2 micrometres can yield better wetting because they have a larger surface area. Thus, more intermolecular interactions at closer distances can arise, yielding stronger attractions and larger adhesive strength.

  6. Adhesion - Wikipedia

    en.wikipedia.org/wiki/Adhesion

    Adhesive materials fill the voids or pores of the surfaces and hold surfaces together by interlocking. Other interlocking phenomena are observed on different length scales. Sewing is an example of two materials forming a large scale mechanical bond, velcro forms one on a medium scale, and some textile adhesives (glue) form one at a small scale.

  7. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    The success or failure of the bond is based on measuring the applied force, the failure type due to the applied force and the visual appearance of the residual medium used. A development in bond strength testing of adhesively bonded composite structures is laser bond inspection (LBI). LBI provides a relative strength quotient derived from the ...

  8. Nanomaterials - Wikipedia

    en.wikipedia.org/wiki/Nanomaterials

    Therefore, it is critical to see how these properties also get affected by the size of a material. Again, AFM is a technique most used to measure these properties and to determine the adhesive strength of nanoparticles to any solid surface, along with the colloidal probe technique and other chemical properties. [63]

  9. Pressure-sensitive adhesive - Wikipedia

    en.wikipedia.org/wiki/Pressure-sensitive_adhesive

    Adhesives may be broadly divided in two classes: structural and pressure-sensitive. To form a permanent bond, structural adhesives harden via processes such as evaporation of solvent (for example, white glue), reaction with UV radiation (as in dental adhesives), chemical reaction (such as two part epoxy), or cooling (as in hot melt).