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  2. Makita - Wikipedia

    en.wikipedia.org/wiki/Makita

    Makita circular saw. Makita Corporation (株式会社マキタ, kabushiki gaisha Makita) (TYO: 6586) is a Japanese manufacturer of power tools.Founded on March 21, 1915, it is based in Anjō, Japan and operates factories in Brazil, China, Japan, Mexico, Romania, the United Kingdom, Germany, United Arab Emirates, Thailand, Indonesia, Malaysia, Philippines, Canada, and the United States.

  3. Angle grinder - Wikipedia

    en.wikipedia.org/wiki/Angle_grinder

    Angle grinder. An angle grinder, also known as a side grinder or disc grinder, is a handheld power tool used for grinding (abrasive cutting) and polishing.Although developed originally as tools for rigid abrasive discs, the availability of an interchangeable power source has encouraged their use with a wide variety of cutters and attachments.

  4. Electropolishing - Wikipedia

    en.wikipedia.org/wiki/Electropolishing

    It is commonly used in the post-production of large metal pieces such as those used in drums of washing machines, bodies of ocean vessels and aircraft, and automobiles. While nearly any metal may be electropolished, the most-commonly polished metals are 300- and 400-series stainless steel , aluminum, copper, titanium, and nickel- and copper-alloys.

  5. What the '2 percent' actually means in 2 percent milk — and ...

    www.aol.com/2017-10-30-what-the-2-percent...

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  6. Polishing (metalworking) - Wikipedia

    en.wikipedia.org/wiki/Polishing_(metalworking)

    The condition of the material at hand determines what type of abrasive will be applied. The first stage, if the material is unfinished, starts with a rough abrasive (perhaps 60 or 80 grit) and each subsequent stage uses a finer abrasive, such as 120, 180, 220/240, 320, 400 and higher grit abrasives, until the desired finish is achieved.

  7. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    Since the oxidizing species such as water or oxygen are unable to diffuse through the mask, the nitride prevents the oxidation. Next, the etching process is used to etch the wafer and leave a small amount of oxide in the active areas. In the end, CMP is used to polish the SiO 2 overburden with an oxide on the active area.