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Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.
Thus, indirectly, thermal velocity is a measure of temperature. Technically speaking, it is a measure of the width of the peak in the Maxwell–Boltzmann particle velocity distribution. Note that in the strictest sense thermal velocity is not a velocity, since velocity usually describes a vector rather than simply a scalar speed.
The term "hot electron" comes from the effective temperature term used when modelling carrier density (i.e., with a Fermi-Dirac function) and does not refer to the bulk temperature of the semiconductor (which can be physically cold, although the warmer it is, the higher the population of hot electrons it will contain all else being equal).
Ion implantation is a low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the target's physical, chemical, or electrical properties. Ion implantation is used in semiconductor device fabrication and in metal finishing, as well as in materials science research. The ions can alter the ...
A BJT uses a single crystal of material in its circuit that is divided into two types of semiconductor, an n-type and p-type. These two types of doped semiconductors are spread over three different regions in respective order: the emitter region, the base region and the collector region. The emitter region and collector region are quantitively ...
These will be based on diamond and aluminum nitride technology, which revolutionizes semiconductor electronics by increasing power delivery and thermal management in sensors and other electronic ...
By precisely controlling the temperature gradients, rate of pulling and speed of rotation, it is possible to extract a large, single-crystal, cylindrical ingot from the melt. Occurrence of unwanted instabilities in the melt can be avoided by investigating and visualizing the temperature and velocity fields during the crystal growth process. [ 7 ]
This velocity is a characteristic of the material and a strong function of doping or impurity levels and temperature. It is one of the key material and semiconductor device properties that determine a device such as a transistor's ultimate limit of speed of response and frequency.