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DisplayLink launched its first semiconductor product family, the DL-120 and DL-160 USB 2.0 graphics devices, in January 2007, [10] signaling a change in the company's business plan from FPGA-based systems to semiconductors. The DL-120 and DL-160 allow up to six additional monitors to be added to a PC through USB 2.0.
The USB Power Delivery specification revision 2.0 (USB PD Rev. 2.0) has been released as part of the USB 3.1 suite. [65] [72] [73] It covers the USB-C cable and connector with a separate configuration channel, which now hosts a DC coupled low-frequency BMC-coded data channel that reduces the possibilities for RF interference. [74]
Connectors are identical for USB 2.0 and USB 1.x. SuperSpeed (SS) rate of 5.0 Gbit/s. The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5]
Many USB bridge / data transfer cables are still USB 2.0, but there are also a number of USB 3.0 transfer cables. Despite USB 3.0 being 10 times faster than USB 2.0, USB 3.0 transfer cables are only 2 to 3 times faster given their design. [clarification needed]
This permits a much lighter cable and a much smaller connector on the mobile device, as a typical MHL source will be shared with USB 2.0 on a standard 5-pin Micro-USB receptacle. [1] (Although MHL ports can be dedicated to MHL alone, the standard is designed to permit port sharing with the most commonly used ports.)
A powered USB hub may sidestep the issue, if supported, since it will then provide its own power according to either the USB 2.0 or USB 3.0 specifications. Some incompatibilities in both HNP and SRP were introduced between the 1.3 and 2.0 versions of the OTG supplement, which can lead to interoperability issues when using those protocol versions.