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Porous silicon (abbreviated as "PS" or "pSi") is a form of the chemical element silicon that has introduced nanopores in its microstructure, rendering a large surface to volume ratio in the order of 500 m 2 /cm 3.
NanoCleave is a technology developed by Silicon Genesis Corporation that separates the silicon via stress at the interface of silicon and silicon-germanium alloy. [18] ELTRAN is a technology developed by Canon which is based on porous silicon and water cut. [19] Seed methods [20] - wherein the topmost Si layer is grown directly on the insulator ...
This porous material could emit visible light when a current was passed through it (electroluminescence). Later the group demonstrated the biocompatibility of porous silicon. Canham now works as Chief Scientific Officer of psiMedica (part of pSiVida). According to the pSiVida web site, Canham is the most cited author on porous silicon.
Rivas, in his early research focused on light propagation through strongly scattering media and Anderson localization of light. In his 1999 work, he explored the fundamental physics of light-matter interaction within disordered scattering materials, such as polydisperse semiconductor powders and porous layers.
A porous medium or a porous material is a material containing pores (voids). The skeletal portion of the material is often called the "matrix" or "frame". The pores are typically filled with a fluid (liquid or gas). There are many natural nanoporous materials, but artificial materials can also be manufactured.
Semiconductor Science and Technology is a peer-reviewed scientific journal covering all applied or explicitly applicable experimental and theoretical studies of the properties of semiconductors and their interfaces, devices, and packaging. The journal publishes different article types including research papers, rapid communications, and topical ...
MACE is a relatively new technology in semiconductor engineering and therefore it has yet to be a process that is used in industry. The first attempts of MACE consisted of a silicon wafer that was partially covered with aluminum and then immersed in an etching solution. [ 2 ]
In semiconductor manufacturing, a low-κ is a material with a small relative dielectric constant (κ, kappa) relative to silicon dioxide.Low-κ dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices, colloquially referred to as extending Moore's law.