Ads
related to: laser trimming thin film resistor construction equipment for sale on ebay
Search results
Results From The WOW.Com Content Network
Laser trimming is the manufacturing process of using a laser to adjust the operating parameters of an electronic circuit. Laser-trimmed precision thin-film resistor network from Fluke, used in the Keithley DMM7510 multimeter. Ceramic backed with glass hermetic seal cover. Laser trim marks are visible in the grey resistive material.
With laser trimming two modes are used; either passive trimming, where each resistor is trimmed to a specific value and tolerance, or active trimming, where the feedback is used to adjust to a specific voltage, frequency or response by laser trimming the resistors on the circuit while powered up.
The resistance of both thin and thick film resistors after manufacture is not highly accurate; they are usually trimmed to an accurate value by abrasive or laser trimming. Thin film resistors are usually specified with tolerances of 1% and 5%, and with temperature coefficients of 5 to 50 ppm/K.
A: preset resistor, B: preset resistor (alternate), C: preset potentiometer, D preset potentiometer (alternate), E: preset inductor, F: preset capacitor. In circuit diagrams, the symbol for a variable component is the symbol for a fixed component with a diagonal line through it terminating in an arrow head.
Resistor based on the sheet resistance of carbon film Sheet resistance is the resistance of a square piece of a thin material with contacts made to two opposite sides of the square. [ 1 ] It is usually a measurement of electrical resistance of thin films that are uniform in thickness.
Laser beam machining is best suited for brittle materials with low conductivity, but can be used on most materials. [2] Laser beam machining can be done on glass without melting the surface. With photosensitive glass, the laser alters the chemical structure of the glass allowing it to be selectively etched. The glass is also referred to as ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
A laser line level is a tool combining a spirit level and/or plumb bob with a laser to display an accurately horizontal or vertical illuminated line on a surface the laser line level is laid against. Laser line levels are used wherever accurate verticals and horizontals are required, typically in the construction and cabinetry industries.