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Heat seal connectors are used to join LCDs to PCBs in many consumer electronics, as well as in medical and telecommunication devices.. Heat sealing of products with thermal adhesives is used to hold clear display screens onto consumer electronic products and for other sealed thermo-plastic assemblies or devices where heat staking or ultrasonic welding are not an option due to part design ...
In the 19th century, hot stamping became a popular method of applying gold tooling or embossing in book printing on leather and paper. [5] The first patent for hot stamping was recorded in Germany by Ernst Oeser in 1892. [2] From the 1950s onward, the method became a popular means of marking plastic . [4]
Example of hand held electric heat gun Commercial heat gun kit Flame heat gun for shrinkwrapping helicopter. A heat gun is a device used to emit a stream of hot air, usually at temperatures between 100 and 550 °C (373 and 823 K; 212 and 1,022 °F), with some hotter models running around 760 °C (1,030 K; 1,400 °F), which can be held by hand.
A hot glue gun loaded with a glue stick. Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun.
Embossing (manufacturing), commercial scale embossing of sheet metal; Image embossing, the process to create highlights or shadows that will replace light/dark boundaries of an image; Leather embossing; Paper embossing, the raising of paper and other non-metal products using specific tools to accomplish the task
Sheet metal embossing is a metalworking process for producing raised or sunken designs or relief in sheet metal. In contrast to coining (which uses unmatched dies), embossing uses matched male and female dies [ 1 ] to achieve the pattern, either by stamping , or by passing a sheet or strip of metal between patterned rollers . [ 2 ]
A variety of structures with resolution better than 10 nm have been imprinted into silicon using LADI, and the embossing time is less than 250 ns. The high resolution and speed of LADI, attributed to molten silicon's low viscosity (one-third that of water), could open up a variety of applications and be extended to other materials and ...
While the other polymer microreplication processes such as micro injection moulding or (vacuum) hot embossing are primary forming processes where forming occurs already in a molten, liquid phase of the heated polymer material, microthermoforming is a secondary forming process where forming occurs in a strongly softened, but still solid phase of ...