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An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board (PCB).. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors ...
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
Kilby's invention was a hybrid integrated circuit (hybrid IC), rather than a monolithic integrated circuit (monolithic IC) chip. [1] Between late 1958 and early 1959, Kurt Lehovec of Sprague Electric Company developed a way to electrically isolate components on a semiconductor crystal, using p–n junction isolation.
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...
hybrid integrated circuit (HIC) – a miniaturized circuit constructed of both semiconductor devices and passive components bonded to a substrate IC – see integrated circuit integrated circuit (IC) – a miniature electronic circuit formed by microfabrication on semiconducting material, performing the same function as a larger circuit made ...
A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. [1]
The MIL-PRF-38534 specification establishes the general performance requirements for hybrid microcircuits (hybrid integrated circuit), multi-chip modules (MCM) and, similar devices and the verification and validation requirements for ensuring that these devices meet the applicable performance requirements. Verification is accomplished through ...
A hybrid integrated circuit. Multiple semiconductor dies and discrete components can be assembled on a ceramic substrate and interconnected with wire bonds. The substrate bears leads for connection to an external circuit, and the whole is covered with a welded or frit cover.