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  2. Thermal profiling - Wikipedia

    en.wikipedia.org/wiki/Thermal_profiling

    In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14 144

  4. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

  5. Process window index - Wikipedia

    en.wikipedia.org/wiki/Process_Window_Index

    Within this process window, values are plotted. The values relative to the process mean of the window are known as the process window index. By using PWI values, processes can be accurately measured, analyzed, compared, and tracked at the same level of statistical process control and quality control available to other manufacturing processes. [3]

  6. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Hot-bar reflow is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode) to a temperature sufficient to melt the solder. Pressure is applied through the entire process (usually 15 seconds) to ensure that components stay in place during cooling.

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  8. Homologous temperature - Wikipedia

    en.wikipedia.org/wiki/Homologous_temperature

    This is borne out by its comparatively low values for tensile strength, shear strength and modulus of elasticity. Copper, on the other hand, has a much higher melting point, so foils are working at only 0.16T mp to 0.29T mp and their properties are little affected by temperature.

  9. Soldering iron - Wikipedia

    en.wikipedia.org/wiki/Soldering_iron

    Solder melts at approximately 185 °C (365 °F). Soldering irons are designed to reach a temperature range of 200 to 480 °C (392 to 896 °F). [1] Soldering irons are most often used for installation, repairs, and limited production work in electronics assembly. High-volume production lines use other soldering methods. [2]