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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Simultaneous multithreading (SMT) is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better use the resources provided by modern processor architectures .
Surface mount components are placed along the front (and often back) faces of the machine. Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine. Larger integrated circuits (ICs) are sometimes supplied and arranged in trays which are stacked in a compartment. More commonly used ...
Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.
They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operational amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.
Flexible placer, chip shooter, and other specialized machines. PWB with solder print. Components supplied by feeders. Computer files: computer program controls location of each component on the PWB (X, Y and angular theta), feeder inventory levels, placement machine vacuum holder capability, automatic component realignment, placement accuracy, vision systems, and transportation of PCBs through ...
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just ...