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PCIe lanes [d] Gen 4 None ×8 ×12 ×8 ×12 Gen 3 Up to ×8 Up to ×4 Up to ×8 Up to ×4 Up to ×8 USB support USB 2.0: 6 12 6 12 USB 3.2 Gen 1x1 (5 Gb/s) 2 None USB 3.2 Gen 2x1
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [ 2 ] [ 3 ] AM5 was launched in September 2022 and is the successor to AM4 .
Network interface controller, Wi-Fi, and Bluetooth are provided by external chips connected to the chipset through PCIe or USB. All 300 series chipsets are made using 55 nm lithography. [ 43 ] The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process.
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock. [26] [27] [28]
The revealed socket Contacts of the Intel Core 9 Ultra 285K (left; LGA 1851), and i9-14900K (right, Socket 1700). LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS and Arrow Lake-S desktop processors, released in October 24, 2024.
Zen 5 was designed with both 4nm and 3nm processes in mind. This acted as an insurance policy for AMD in the event that TSMC's mass production of its N3 nodes were to face delays, significant wafer defect issues or capacity issues.