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Doping of a pure silicon array. Silicon based intrinsic semiconductor becomes extrinsic when impurities such as boron and antimony are introduced.. In semiconductor production, doping is the intentional introduction of impurities into an intrinsic (undoped) semiconductor for the purpose of modulating its electrical, optical and structural properties.
For example, doping pure silicon with a small amount of phosphorus will increase the carrier density of electrons, n. Then, since n > p, the doped silicon will be a n-type extrinsic semiconductor. Doping pure silicon with a small amount of boron will increase the carrier density of holes, so then p > n, and it will be a p-type extrinsic ...
While there is considerable scatter in the experimental data, for noncompensated material (no counter doping) for heavily doped substrates (i.e. and up), the mobility in silicon is often characterized by the empirical relationship: [37] = + + where N is the doping concentration (either N D or N A), and N ref and α are fitting parameters.
Phosphorus atom acting as a donor in the simplified 2D silicon lattice. For example, when silicon (Si), having four valence electrons, is to be doped as a n-type semiconductor, elements from group V like phosphorus (P) or arsenic (As) can be used because they have five valence electrons. A dopant with five valence electrons is also called a ...
Silicon wafers are generally not 100% pure silicon, but are instead formed with an initial impurity doping concentration between 10 13 and 10 16 atoms per cm 3 of boron, phosphorus, arsenic, or antimony which is added to the melt and defines the wafer as either bulk n-type or p-type. [27]
A degenerate semiconductor is a semiconductor with such a high level of doping that the material starts to act more like a metal than a semiconductor. Unlike non-degenerate semiconductors, these kinds of semiconductor do not obey the law of mass action, which relates intrinsic carrier concentration with temperature and bandgap.
A pulsed laser is directed at the silicon wafer and this results in localised melting and subsequent recrystallisation of the silicon wafer material, allowing boron atoms in the gas to diffuse into the molten sections of the silicon wafer. [1] The result of this process is a silicon wafer with boron impurities, creating a P-type semiconductor.
Monolayer doping (MLD) in semiconductor production is a well controlled, wafer-scale surface doping technique first developed at the University of California, Berkeley, in 2007. [1] This work is aimed for attaining controlled doping of semiconductor materials with atomic accuracy, especially at nanoscale , which is not easily obtained by other ...