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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Flatpack was one of the earliest surface-mounted packages. Small-outline integrated circuit (SOIC): dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm. Small-outline package, J-leaded (SOJ): The same as SOIC except J-leaded. [80] Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm.
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1.6 mm (0.063 in) instead of 1.3 mm (0.051 in).
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The contacts are not pins, but small flat bands of metal, called ribbon contacts. The connectors are manufactured in many capacities, including 14-, 24-, 36-, 50-, 64-, and 100-pin varieties. They may be mounted on boards, panels, or may terminate cables. Wires are attached by means of solder, crimping or insulation displacement.