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Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by a chemical or electrochemical (electroplating) process.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
This process is limited to very thin coatings, since the reaction stops after the substrate has been completely covered. Nevertheless, it has some important applications, such as the electroless nickel immersion gold (ENIG) process used to obtain gold-plated electrical contacts on printed circuit boards.
Electroless deposition is the process by which metal cation is reduced to elemental metal with a powerful reducing agent. [2] [3] [21] Steps in electroless deposition process. The electroless deposition bath constitutes the following reagents which affect the side product synthesis, bath lifetime and plating rates.
The gold is typically applied by quick immersion in a solution containing gold salts. This process is known in the industry as electroless nickel immersion gold (ENIG). A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. [19]