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The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier.
Common features of Ryzen 4000 notebook APUs: Socket: FP6. All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: TSMC 7FF.
AMD PowerNow! is AMD's dynamic frequency scaling and power saving technology for laptop processors. The CPU 's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise .
As of 2019, AMD's Ryzen processors were reported to outsell Intel's consumer desktop processors. [187] At CES 2020 AMD announced their Ryzen Mobile 4000, as the first 7 nm x86 mobile processor, [vague] the first 7 nm 8-core (also 16-thread) high-performance mobile processor, and the first 8-core (also 16-thread) processor for ultrathin laptops ...
It looks like AMD’s Ryzen 7000 clock rates will break the 5GHz barrier. AMD has been teasing the next generation of its processors for a bit now. But, it looks like the company is finally ready ...
The table does not cover the following common features: Socket (FP6) Memory support (DDR4-3200 or LPDDR4-4266 in dual-channel mode) L1 cache (64KB / 32+32KB per core)
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.