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Starting in the late 1940s the carpet cleaning floor nozzle with the brush roller could be removed, and the 1948 owners manual for the Model 508 called it the "Triple-Cushion Vibrator", [12] which was powered by a removable rubber belt that was in contact with a metal shaft extending from the vacuum turbine blades, powered by the electric motor ...
8 in (203 mm) wire brush mounted to a bench grinder. The wire brush is primarily an abrasive implement, used for cleaning rust and removing paint. It is also used to clean surfaces and to create a better conductive area for attaching electrical connections, such as those between car battery posts and their connectors, should they accumulate a build-up of grime and dirt.
Ultra-high vacuum (UHV) components are typically electropolished in order to have a smoother surface for improved vacuum pressures, out-gassing rates, and pumping speed. Electropolishing is commonly used to prepare thin metal samples for transmission electron microscopy and atom probe tomography [ 6 ] because the process does not mechanically ...
Power shovels are a type of rope/cable excavator, where the digging arm is controlled and powered by winches and steel ropes, rather than hydraulics like in the modern hydraulic excavators. Basic parts of a power shovel include the track system, cabin, cables, rack, stick, boom foot-pin, saddle block, boom, boom point sheaves and bucket.
Materials may sublimate in vacuum (this includes some metals and their alloys, most notably cadmium and zinc). Or the gases can be released from porous materials or from cracks and crevices. Traces of lubricants, residues from machining, can be present on the surfaces. A specific risk is outgassing of solvents absorbed in plastics after cleaning.
In order to compensate for the wafer bow, pressure can be applied to the wafer's backside which, in turn, will equalize the centre-edge differences. The pads used in the CMP tool should be rigid in order to uniformly polish the wafer surface. However, these rigid pads must be kept in alignment with the wafer at all times.