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  2. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Before plating, the surface of the material must be thoroughly cleaned. Unwanted solids left on the surface cause poor plating. Cleaning is usually achieved by a series of chemical baths, including non-polar solvents to remove oils and greases, as well as acids and alkalis to remove oxides, insoluble organics, and other surface contaminants.

  3. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]

  4. Lip plate - Wikipedia

    en.wikipedia.org/wiki/Lip_plate

    The lip plate, also known as a lip plug, lip disc, or mouth plate, is a form of body modification. Increasingly large discs (usually circular, and made from clay or wood) are inserted into a pierced hole in either the upper or lower lip , or both, thereby stretching it.

  5. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroless processes are widely used to deposit nickel-phosphorus or nickel-boron alloys for wear and corrosion resistance, silver for mirror-making, copper for printed circuit boards, and many more. A major advantage of these processes over electroplating is that they can produce coatings of uniform thickness over surfaces of arbitrary shape ...

  6. Electroless nickel-boron plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel-boron...

    Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...

  7. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

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