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Common features of Ryzen Z1 handheld APUs: Socket: FP7, FP7r2, FP8. All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. All the CPUs support 20 PCIe 4.0 lanes. Includes integrated RDNA 3 GPU. Fabrication process: TSMC 4 nm FinFET.
Common features of Ryzen Z1 handheld APUs: Socket: FP7, FP7r2, FP8. All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. All the CPUs support 20 PCIe 4.0 lanes. Includes integrated RDNA 3 GPU. Fabrication process: TSMC 4 nm FinFET.
Concrete products are codenamed "Llano": List of AMD accelerated processing units. Llano AMD Fusion ( K10 cores + Redwood -class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017)
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.
Integrated custom ARM Cortex-A5 co-processor [45] with TrustZone Security Extensions [46] in select APU models, except the Performance APU models. [ 47 ] Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
TRX50 is an HEDT (High-End Desk-Top) platform which is intended to be paired with Threadripper (7000X) series processors, but is also compatible with Threadripper Pro models. When a Threadripper Pro CPU is paired with a TRX50 motherboard, extra features like enterprise management and security won't be available to the user, and PCIe lanes and ...
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...