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Skiving machine producing copper heat sink fins. Skiving is also used for the manufacturing of heat sinks for PC cooling products. A PC cooler created by skiving has the benefit that the heat sink base and fins are created from a single piece of material (copper or aluminum), providing improved heat dissipation and heat transfer from base to fins.
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
The minimum amount of radius required to avoid any defect and problems depends on the extrudability of the material, as the material is more extrudable it can flow in corners with less radius. For example, for Aluminium, Magnesium and Copper alloys the minimum radius required for corners and edges is 0.75 mm whereas for ferrous metals for ...
To create a tractable equation for the heat transfer of a fin, many assumptions need to be made: Steady state; Constant material properties (independent of temperature) No internal heat generation; One-dimensional conduction; Uniform cross-sectional area; Uniform convection across the surface area
It can also be moulded, extruded, skived, stamped, and hot and cold formed. Below is a table of properties pertaining to Rulon AR, but note that the other types of Rulon have similar properties. Below is a table of properties pertaining to Rulon AR, but note that the other types of Rulon have similar properties.
For example, minimum thickness of extruded carbon steel sheet is 3mm whereas same sheet of aluminium can be extruded into minimum sheet thicknesses of 1mm. A variety of materials such as Carbon steel, aluminium, titanium, magnesium, ABS and PVC etc. can be manufactured via extrusion processes.
The thermodynamic properties of materials are intensive thermodynamic parameters which are specific to a given material. Each is directly related to a second order differential of a thermodynamic potential. Examples for a simple 1-component system are: Compressibility (or its inverse, the bulk modulus) Isothermal compressibility
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).