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All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF. Bundled with AMD Wraith Stealth; The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2 ...
Zen 3+ series CPUs and APUs (released 2022) Rembrandt Ryzen 6000 series (laptop) ... Text is available under the Creative Commons Attribution-ShareAlike 4.0 License; ...
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
To keep costs low on high-volume competitive products, the CPU core is usually bundled into a system-on-chip (SOC) integrated circuit. SOCs contain the processor core, cache and the processor's local data on-chip, along with clocking, timers, memory (SDRAM), peripheral (network, serial I/O), and bus (PCI, PCI-X, ROM/Flash bus, I2C) controllers.
Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, [5] H-series mobile CPUs on April 2, 2020, [6] desktop Comet Lake-S CPUs April 30, 2020, [7] and Xeon W-1200 series workstation CPUs on May 13, 2020. [8] Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. [9]