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Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by a chemical or electrochemical (electroplating) process.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
It is filled with a sample of the plating solution and an appropriate anode which is connected to a rectifier. The "work" is replaced with a Hull cell test panel that will be plated to show the "health" of the bath. The Hull cell is a trapezoidal container that holds 267 milliliters of a plating bath solution.
The gold(III) chloride can also be dissolved in water in electroless plating wherein the gold is slowly reduced out of solution onto the surface to be gilded. When this technique is used on the second surface of glass and backed with silver, it is known as " Angel gilding ".
The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf /cm or 10 to 60 N /cm or 5 to 35 lbf /in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
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Adhesion of a plated metal layer to its substrate requires a physical interlocking, inter-diffusion of the deposit or a chemical bonding between plate and substrate in order to work. The role of a diffusion barrier is to prevent or to retard the inter-diffusion of the two superposed metals.