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For instance, potassium hydroxide (KOH) displays an etch rate selectivity 400 times higher in <100> crystal directions than in <111> directions. EDP (an aqueous solution of ethylene diamine and pyrocatechol ), displays a <100>/<111> selectivity of 17X, does not etch silicon dioxide as KOH does, and also displays high selectivity between lightly ...
2007 Toyota Yaris hatchback owner's manual 1919 Ford Motor Company car and truck operating manual. An owner's manual (also called an instruction manual or a user guide) is an instructional book or booklet that is supplied with almost all technologically advanced consumer products such as vehicles, home appliances and computer peripherals.
The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few milli torr and a few hundred millitorr by adjusting gas flow rates and/or adjusting an exhaust orifice.
Fig. 1. The surface of a MEMS device is cleaned with bright, blue oxygen plasma in a plasma etcher to rid it of carbon contaminants. (100mTorr, 50W RF) Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species.
The optional second step (for bare silicon wafers) is a short immersion in a 1:100 or 1:50 solution of aqueous HF (hydrofluoric acid) at 25 °C for about fifteen seconds, in order to remove the thin oxide layer and some fraction of ionic contaminants. If this step is performed without ultra high purity materials and ultra clean containers, it ...
Sonorex ultrasonic cleaner from the 1970s or 1980s Ultrasonic cleaning of a mobile phone. Ultrasonic cleaning is a process that uses ultrasound (usually from 20 to 40 kHz) to agitate a fluid, with a cleaning effect. Ultrasonic cleaners come in a variety of sizes, from small desktop units with an internal volume of less than 0.5 litres (0.13 US ...
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
The second way to apply hard ground is by liquid hard ground. This comes in a can and is applied with a brush upon the plate to be etched. Exposed to air the hard ground will harden. Some printmakers use oil/tar based asphaltum [18] or bitumen as hard ground, although often bitumen is used to protect steel plates from rust and copper plates ...