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A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 banks for each bank group for ×16 DRAM. The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed
DRAM SO-DIMM. In 2002, the United States Department of Justice, under the Sherman Antitrust Act, began a probe into the activities of dynamic random-access memory (DRAM) manufacturers in response to claims by US computer makers, including Dell and Gateway, that inflated DRAM pricing was causing lost profits and hindering their effectiveness in the marketplace.
In June 2020, Lexar announced its entry to the DRAM market by unveiling seven different DDR4-2666 memory kits for mainstream laptops and desktops. Lexar also plans to release faster, 3000 MHz and 3200 MHz memory kits in the future, along with kits "with heatsinks and RGB lighting", targeting gamers and enthusiasts.
As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. DDR3-2000 memory with 9-9-9-28 latency (9 ns) was available in time to coincide with the Intel Core i7 release in late 2008, [ 19 ] while later developments made DDR3-2400 widely available (with CL 9–12 cycles = 7.5–10 ns), and ...
On June 25, 2008, AMD became the first company to ship products using GDDR5 memory with its Radeon HD 4870 video card series, incorporating Qimonda's 512 Mb memory modules at 3.6 Gbit/s bandwidth. [13] [14] In June 2010, Elpida Memory announced the company's 2 Gb GDDR5 memory solution, which was developed at the company's Munich Design Center ...